Thermaltake TG-4 heat sink compound 3.3 W/m·K 0.0529 oz (1.5 g)

Thermaltake high performance and exceptional reliability Thermal grease, to maximize heat transfer by eliminating the minuite air gap between the heat source and the heat sink caused by their irregular surfaces.
High Thermal Conductivity Lighter, easier to spread stable composition won’t crack or dry out, delivering excellent long-lasting thermal conductivity.
High Fluidity Producing an even layer with high fluidity when using applicator.
Long life span More effective than standard silicon-based heat grease/CPU paste, providing optimum protection against CPU heat damage for a long life span usage.
Made for Extreme Performance TG-4 is optimized for use between modern high-power CPUs and high-performance heatsinks or water-cooling solutions.
Easy to use Easy to use on the contact surface of the heatsink to improve the heat dissipation of the processor