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Transcend MTE470A 256 GB M.2 PCI Express 3.1 NVMe 3D NAND1

Transcend MTE470A 256 GB M.2 PCI Express 3.1 NVMe 3D NAND

Transcend MTE470A. SSD capacity: 256 GB, SSD form factor: M.2, Component for: PC/Laptop
Manufacturers: Transcend , TRANSCEND INFORMATION
SKU: 7130896
Manufacturer part number: TS256GMTE470A
GTIN: 760557859666
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Transcend's MTE460T PCIe M.2 SSD features a PCIe Gen 3x2 interface and 112-layer 3D NAND flash, delivering breakthrough density that greatly improves storage efficiency. In addition, the 30µ" gold finger PCB, Corner Bond technology, and anti-sulfur resistors guarantee its reliability in harsh conditions. Transcend's MTE460T is also 100% chamber tested in-house for extended operating temperatures of -20℃~75℃. Wide-temp capability (-40℃~85℃) can also be provided upon request, optimizing stability in extreme environments.

 

  • Supports NVM command
  • Dynamic thermal throttling
  • Built-in LDPC ECC (Error Correction Code) functionality
  • Advanced Global Wear-Leveling and Block management for reliability
  • Advanced Garbage Collection
  • Static Data Refresh
  • Early Move
  • Supports S.M.A.R.T. function to conduct health monitoring, analysis, and reporting for storage devices
  • TRIM command for better performance
  • NCQ command for better performance
  • Full drive encryption with Advanced Encryption Standard (AES) (optional)
  • Compliant with RoHS 2.0 standards
  • Compliant with NVM Express specification 1.3
  • Compliant with PCI Express specification 3.1
  • Space-saving M.2 form factor (42mm) – ideal for mobile computing devices
  • PCIe Gen 3 x2 interface
Transcend's MTE460T PCIe M.2 SSD features a PCIe Gen 3x2 interface and 112-layer 3D NAND flash, delivering breakthrough density that greatly improves storage efficiency. In addition, the 30µ" gold finger PCB, Corner Bond technology, and anti-sulfur resistors guarantee its reliability in harsh conditions. Transcend's MTE460T is also 100% chamber tested in-house for extended operating temperatures of -20℃~75℃. Wide-temp capability (-40℃~85℃) can also be provided upon request, optimizing stability in extreme environments.

 

  • Supports NVM command
  • Dynamic thermal throttling
  • Built-in LDPC ECC (Error Correction Code) functionality
  • Advanced Global Wear-Leveling and Block management for reliability
  • Advanced Garbage Collection
  • Static Data Refresh
  • Early Move
  • Supports S.M.A.R.T. function to conduct health monitoring, analysis, and reporting for storage devices
  • TRIM command for better performance
  • NCQ command for better performance
  • Full drive encryption with Advanced Encryption Standard (AES) (optional)
  • Compliant with RoHS 2.0 standards
  • Compliant with NVM Express specification 1.3
  • Compliant with PCI Express specification 3.1
  • Space-saving M.2 form factor (42mm) – ideal for mobile computing devices
  • PCIe Gen 3 x2 interface
Products specifications
Attribute nameAttribute value
Width0.866"
Depth1.65"
Height0.141"
Weight0.176 oz
Data retention3 year(s)
PCI Express interface data lanesx2
PCI Express CEM revision3.1
Sequential read speed (CDM)1700 MB/s
Sequential write speed (CDM)1500 MB/s
TBW rating900
Power consumption (average)2.9 W
NVMe version1.3
M.2 key IDB+M
M.2 SSD size2242 (22 x 42 mm)
Drive writes per day (DWPD)0.86
Compliance certificatesBSMI, CE, Federal Communications Commission (FCC), UKCA
Features
Component forPC/Laptop
ECCYes
Mean time between failures (MTBF)3000000 h
SSD capacity256 GB
Memory type3D NAND
Random read (4KB)92000 IOPS
S.M.A.R.T. supportYes
Native Command Queuing (NCQ)Yes
NVMeYes
Random write (4KB)225000 IOPS
TRIM supportYes
SSD form factorM.2
Operational conditions
Operating temperature (T-T)-20 - 75 °C
Storage temperature (T-T)-40 - 85 °C
Operating relative humidity (H-H)5 - 95 %
Operating shock15 G
Operating vibration20 G
Ports & interfaces
InterfacePCI Express 3.1
Power
Power consumption (idle)0.33 W
Operating voltage3.3 V
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Products specifications
Attribute nameAttribute value
Width0.866"
Depth1.65"
Height0.141"
Weight0.176 oz
Data retention3 year(s)
PCI Express interface data lanesx2
PCI Express CEM revision3.1
Sequential read speed (CDM)1700 MB/s
Sequential write speed (CDM)1500 MB/s
TBW rating900
Power consumption (average)2.9 W
NVMe version1.3
M.2 key IDB+M
M.2 SSD size2242 (22 x 42 mm)
Drive writes per day (DWPD)0.86
Compliance certificatesBSMI, CE, Federal Communications Commission (FCC), UKCA
Features
Component forPC/Laptop
ECCYes
Mean time between failures (MTBF)3000000 h
SSD capacity256 GB
Memory type3D NAND
Random read (4KB)92000 IOPS
S.M.A.R.T. supportYes
Native Command Queuing (NCQ)Yes
NVMeYes
Random write (4KB)225000 IOPS
TRIM supportYes
SSD form factorM.2
Operational conditions
Operating temperature (T-T)-20 - 75 °C
Storage temperature (T-T)-40 - 85 °C
Operating relative humidity (H-H)5 - 95 %
Operating shock15 G
Operating vibration20 G
Ports & interfaces
InterfacePCI Express 3.1
Power
Power consumption (idle)0.33 W
Operating voltage3.3 V
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