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Kingston Technology FURY KF556R36RBK8-256 memory module 256 GB 8 x 32 GB DDR5 5600 MHz ECC1
Kingston Technology FURY KF556R36RBK8-256 memory module 256 GB 8 x 32 GB DDR5 5600 MHz ECC1
Kingston Technology FURY KF556R36RBK8-256 memory module 256 GB 8 x 32 GB DDR5 5600 MHz ECC2

Kingston Technology FURY KF556R36RBK8-256 memory module 256 GB 8 x 32 GB DDR5 5600 MHz ECC

Kingston Technology FURY KF556R36RBK8-256. Component for: PC, Internal memory: 256 GB, Memory layout (modules x size): 8 x 32 GB, Internal memory type: DDR5, Memory clock speed: 5600 MHz, Memory form factor: 288-pin DIMM, CAS latency: 36, ECC, Product color: Black
Manufacturer: Kingston Technology
SKU: 7294097
Manufacturer part number: KF556R36RBK8-256
GTIN: 0740617335552
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Kingston FURY KF556R36RBK8-256 is a kit of eight 4G x 80-bit (32GB) DDR5-5600 CL36 SDRAM (Synchronous DRAM) 1Rx4, ECC memory module, based on twenty 4G x 4-bit FBGA components per module. The module supports Intel® Extreme Memory Profiles (Intel® XMP) 3.0. Total kit capacity is 256GB. Each module has been tested to run at DDR5-5600 at a low latency timing of 36-38-38 at 1.25V. The SPDs are programmed to JEDEC standard latency DDR5-4800 timing of 40-39-39 at 1.1V. Each 288-pin DIMM uses gold contact fingers.

 

  • Power Supply: VDD = 1.1V Typical
  • VDDQ = 1.1V Typical
  • VPP = 1.8V Typical
  • VDDSPD = 1.8V to 2.0V
  • On-Die ECC
  • x80 ECC (x40, 2 independent I/O sub channels)
  • 32 internal banks
  • Hard/Soft Post Package Repair
  • Sideband access with I3C/I2C
  • PCB: Height 1.23” (31.25mm)
  • RoHS Compliant and Halogen-Free
Kingston FURY KF556R36RBK8-256 is a kit of eight 4G x 80-bit (32GB) DDR5-5600 CL36 SDRAM (Synchronous DRAM) 1Rx4, ECC memory module, based on twenty 4G x 4-bit FBGA components per module. The module supports Intel® Extreme Memory Profiles (Intel® XMP) 3.0. Total kit capacity is 256GB. Each module has been tested to run at DDR5-5600 at a low latency timing of 36-38-38 at 1.25V. The SPDs are programmed to JEDEC standard latency DDR5-4800 timing of 40-39-39 at 1.1V. Each 288-pin DIMM uses gold contact fingers.

 

  • Power Supply: VDD = 1.1V Typical
  • VDDQ = 1.1V Typical
  • VPP = 1.8V Typical
  • VDDSPD = 1.8V to 2.0V
  • On-Die ECC
  • x80 ECC (x40, 2 independent I/O sub channels)
  • 32 internal banks
  • Hard/Soft Post Package Repair
  • Sideband access with I3C/I2C
  • PCB: Height 1.23” (31.25mm)
  • RoHS Compliant and Halogen-Free
Products specifications
Attribute nameAttribute value
Row Precharge Time (TRP)16
Height1.23"
JEDEC standardY
Doesn't containHalogen
Row cycle time48 ns
Refresh row cycle time295 ns
Row active time32 ns
SPD profileY
Intel Extreme Memory Profile (XMP)Y
Intel Extreme Memory Profile (XMP) version3.0
Programming power voltage (VPP)1.8 V
On-Die ECCY
Features
CAS latency36
Memory layout (modules x size)8 x 32 GB
Internal memory256 GB
Internal memory typeDDR5
Memory clock speed5600 MHz
Component forPC
Memory form factor288-pin DIMM
ECCY
Buffered memory typeRegistered (buffered)
Memory voltage1.25 V
Cooling typeHeatsink
Memory ranking4
Operational conditions
Operating temperature (T-T)0 - 95 °C
Storage temperature (T-T)-55 - 100 °C
Technical details
Product colorBlack
Sustainability certificatesRoHS
*
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Products specifications
Attribute nameAttribute value
Row Precharge Time (TRP)16
Height1.23"
JEDEC standardY
Doesn't containHalogen
Row cycle time48 ns
Refresh row cycle time295 ns
Row active time32 ns
SPD profileY
Intel Extreme Memory Profile (XMP)Y
Intel Extreme Memory Profile (XMP) version3.0
Programming power voltage (VPP)1.8 V
On-Die ECCY
Features
CAS latency36
Memory layout (modules x size)8 x 32 GB
Internal memory256 GB
Internal memory typeDDR5
Memory clock speed5600 MHz
Component forPC
Memory form factor288-pin DIMM
ECCY
Buffered memory typeRegistered (buffered)
Memory voltage1.25 V
Cooling typeHeatsink
Memory ranking4
Operational conditions
Operating temperature (T-T)0 - 95 °C
Storage temperature (T-T)-55 - 100 °C
Technical details
Product colorBlack
Sustainability certificatesRoHS
Customer service
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