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Cisco Systems

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Cisco HX-SD38TK1X-EV internal solid state drive 3.8 TB 2.5" SAS1

Cisco HX-SD38TK1X-EV internal solid state drive 3.8 TB 2.5" SAS

7432436
Cisco HX-SD38TK1X-EV. SSD capacity: 3.8 TB, SSD form factor: 2.5", Data transfer rate: 12 Gbit/s, Component for: Server/workstation
Cisco UCS-SD38TK1X-EV= internal solid state drive 3.8 TB 2.5" SAS1

Cisco UCS-SD38TK1X-EV= internal solid state drive 3.8 TB 2.5" SAS

6334858
Cisco UCS-SD38TK1X-EV=. SSD capacity: 3.8 TB, SSD form factor: 2.5", Data transfer rate: 12 Gbit/s, Component for: Server/workstation
Cisco UCS-SD38TKB1X-EV= internal solid state drive 3.8 TB 2.5" SAS1

Cisco UCS-SD38TKB1X-EV= internal solid state drive 3.8 TB 2.5" SAS

7432555
Cisco UCS-SD38TKB1X-EV=. SSD capacity: 3.8 TB, SSD form factor: 2.5", Data transfer rate: 12 Gbit/s, Component for: Server/workstation
Cisco HX-SD38TK1X-EV= internal solid state drive 3.8 TB 2.5" SAS1

Cisco HX-SD38TK1X-EV= internal solid state drive 3.8 TB 2.5" SAS

7432552
Cisco HX-SD38TK1X-EV=. SSD capacity: 3.8 TB, SSD form factor: 2.5", Data transfer rate: 12 Gbit/s, Component for: Server/workstation
Cisco UCS-SD38TH1-EV= internal solid state drive 3.8 TB 2.5" SAS1

Cisco UCS-SD38TH1-EV= internal solid state drive 3.8 TB 2.5" SAS

6221574
Cisco UCS-SD38TH1-EV=. SSD capacity: 3.8 TB, SSD form factor: 2.5", Data transfer rate: 12 Gbit/s, Component for: Server/workstation
Cisco Intel Xeon Gold 6448H processor 2.4 GHz 60 MB1

Cisco Intel Xeon Gold 6448H processor 2.4 GHz 60 MB

7320605
Cisco Intel Xeon Gold 6448H. Processor family: Intel® Xeon® Gold, Processor socket: LGA 4677 (Socket E), Processor manufacturer: Intel. Memory channels: Octa-channel, Maximum internal memory supported by processor: 6 TB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Use conditions: Server/Enterprise, Supported instruction sets: AMX, SSE4.2, AVX, AVX 2.0, AVX-512. Maximum Enclave Size Support for Intel® SGX: 512 GB, Intel® QuickAssist Technology (QAT): 2 default devices, Intel® Dynamic Load Balancer (DLB): 2 default devices. Processor package size: 77.5 x 56.5 mm
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